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- Fiber Array assembly
- Glass V-groove fiber array block coupled to a PIC edge, and terminated with an MT / MPO connector interface. The MT ferrule provides dual guide-pin passive alignment and a detachable, repeatedly mateable optical connection for co-packaged and near-packaged optics.
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- Optical Interconnect
- Optical interconnects are systems that transmit data using light rather than electrical signals. By bypassing traditional copper wires, they provide massive bandwidth, ultra-low latency, and greater energy efficiency. They are essential for scaling AI infrastructure, high-performance computing, and massive scale data centers
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- CPO Interconnector
- Co-Packaged Optics (CPO) is an advanced integration technology that embeds optical interconnects alongside computing or switching chips (like ASICs or GPUs) on the same unified substrate. By replacing traditional long copper traces with microscopic optical paths, CPO drastically reduces power consumption, latency, and signal loss in high-performance AI data centers.
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- Detachable Soltuion
- Detachable optical interface for silicon photonics with micro-optics and magnetic alignment.
Designed for high-density optical interconnects and next-generation co-packaged optics applications.
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