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- Fiber Array assembly
- Fiber Array is used in high-density optical devices such as optical communication modules, optical switches, optical splitters, and optical waveguides by aligning multiple optical fibers at regular intervals. It is used to mechanically fix optical fibers and facilitate their alignment and coupling with other optical elements.
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- Optical Interconnect
- Optical interconnects are systems that transmit data using light rather than electrical signals. By bypassing traditional copper wires, they provide massive bandwidth, ultra-low latency, and greater energy efficiency. They are essential for scaling AI infrastructure, high-performance computing, and massive scale data centers
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- CPO Interconnector
- Co-Packaged Optics (CPO) is an advanced integration technology that embeds optical interconnects alongside computing or switching chips (like ASICs or GPUs) on the same unified substrate. By replacing traditional long copper traces with microscopic optical paths, CPO drastically reduces power consumption, latency, and signal loss in high-performance AI data centers.
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- Detachable Soltuion
- Detachable optical interface for silicon photonics with micro-optics and magnetic alignment.
Designed for high-density optical interconnects and next-generation co-packaged optics applications.
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