- Fiber to the Chip
- Detachable Soltuion
Detachable Soltuion
Detachable optical interface for silicon photonics with micro-optics and magnetic alignment. Designed for high-density optical interconnects and next-generation co-packaged optics applications.
- Product Information
- Specifications
- Order Information
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Features
- Optical Channel#: 12–32 ch
- Fiber Type: Single-mode / Multi-mode
- Insertion Loss: ≤ 1.0 dB class
- Repeatability: Excellent repeated mating performance
- Optics / Alignment: Passive alignment with planar coupling geometry
- Applications: Silicon photonics and co-packaged optics
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Application Area
Specifications
| Parameter | Unit | Specifications | Remarks |
|---|---|---|---|
| Number of Channel | Port | ~1530(10 layers) | Available for customization and multi layers |
| Materials | Silicon, Pyrex(Py ), Qz | Available for customization | |
| Insertion Loss | dB | < 0.5 | Available for customization |
| Return Loss | dB | > 50 | @Angle Polished. |
| Core Pitch / Error | um | 127~250 / 0.5(Si), 0.7(Py, Qz) | Available for customization ( Machine shop in house) |
| Polishing Angle | deg. | Standard:0, 8, 12 ( 0.3) | Available Customization |
| Connector Type | LC, SC, FC | Available Customization | |
| Operating Temp. | ℃ | -10 ~ +70 | |
| Storage Temp. | ℃ | -40 ~ +85 |
Order Information (Detachable Soltuion)
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Edge Coupling
Edge Coupling
Detachable optical interface for silicon photonics with micro-optics and magnetic alignment. Designed for high-density optical interconnects and next-generation co-packaged optics applications.
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Vertical Coupling
Vertical Coupling
Light from a fiber ribbon is redirected by a 45° mirror at the V-groove edge and bent by 90° downward into the silicon photonic chip. This low–loss, passive alignment interface enables reliable coupling for silicon photonics and co-packaged optics.
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Planar Coupling
Planar Coupling
Compact detachable FAH interface for silicon photonics. Planar separation with passive self-aligned optics enables low-loss, repeatable interconnects. Detachable fiber connectivity supports post-reflow assembly for co-packaged optics and advanced optical I/O.